C-SAM Sounds The Warning For IC Packing Defects
P. Yalamanchili, A. Christou, and S. Martel
The reliability of integrated circuit (IC) Packages depends in many
respects on their mechanical integrity. The effect of structural
weaknesses caused by poor bonding, voids, microcracks or delaminations
may not be evident in the electrical performance characteristics, but may
cause premature failure. C-mode scanning acoustic microscopy (C-SAM)
is an excellent tool for non-destructive failure analysis of IC packages.
It provides a rapid and comprehensive imaging of critical package defects
and the location of these defects in three dimensions with in the package.
article is available to CALCE Consortium Members.
© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.