Transactions of the ASME Journal of Electronic Packaging, Vol. 116, pp. 148-153, June 1994.

Investigation of Thermomechanical Properties of low Temperature Cofired Ceramic

J. Hu, D. Barker, R.Ghoshtagore, and M. Pecht


Thermomechanical properties of low temperature cofired ceramic substrates in the range of operational temperatures are necessary to incorporated into the design models for multichip modules and other electronics packages. These properties are also equipped in assessing reliability and aiding in screening and qualification procedures. This paper presents the test methods and experimental results on various thermomechanical properties of low temperature cofired ceramic over the temperature range of -55 degC to +250 degC. Material properties determined from the tests include the modulus of elasticity, the modulus of rupture, the fracture toughness, and the coefficient of thermal expansion.

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