Investigation of Thermomechanical Properties of low Temperature Cofired Ceramic
J. Hu, D. Barker, R.Ghoshtagore, and M. Pecht
Thermomechanical properties of low temperature cofired ceramic substrates
in the range of operational temperatures are necessary to incorporated
into the design models for multichip modules and other electronics packages.
These properties are also equipped in assessing reliability and aiding
in screening and qualification procedures. This paper presents the test
methods and experimental results on various thermomechanical properties
of low temperature cofired ceramic over the temperature range of -55 degC
to +250 degC. Material properties determined from the tests include the
modulus of elasticity, the modulus of rupture, the fracture toughness,
and the coefficient of thermal expansion.
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