Effect Of Temperature And Humidity Cycling On FR-4, Bis-Maleimide Triazine, And Cyanate Ester Printed Wiring Boards
J. Li, K. Gohari and M. Pecht
An experimental investigation was conducted to study potential degradation
characteristics of FR-4, bis-maleimide triazine (BT), and cyanate ester
(CE) printed wiring board materials subject to four thermal cycling experiments,
including 25 to 85° C temperature cycling,
25 to 150° C temperature cycling,
25 to 200° C temperature cycling, and combined
temperature/humidity cycling of 25° C/20%
relative humidity to 85° C/85% relative
humidity. Environmental scanning electron microscope (ESEM) photography
was used to study degradation effects. Resin/fiber interface debonding
was observed. Primarily on the edges of the glass-fiber bundles.
Explanations involve the moisture sorption of epoxy, the mismatch of the
coefficient of thermal expansion of the epoxy-resin and glass-fiber, and
the geometry of glass-fiber bundles.
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