Dynamic Investigation of Thermal And Sorptive Effects
On Electronic Packages
J. Li, and M. Pecht
Temperature and relative humidity affect electrical, chemical, mechanical,
and thermo-mechanical properties of microelectronic packages. Attention
has been focused on the environmental effects that result in various physical
failures. The scanning electron microscope is a useful tool for visually
characterizing these failures, but its use is restricted because the specimens
examined must be coated. The environmental scanning electron microscope
functions like a traditional, high-quality scanning electron microscope,
and also allows the researcher to examine unprepared, un-coated specimens.
This makes it possible to view wet or moist specimens in their natural
states. In this paper, several experimental efforts using the E-SEM
technique are discussed. The first was a study of thermal effects
on L-band microwave monolithic integrated circuits. The second investigation
concentrated on ad/absorptive effects on multi-layer thin film polyimides.
The third study focused on thermal and humidity cycling effects on the
interfaces near platted-through-holes in printed wiring boards.
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