IEEE Transactions on Reliability, Vol. 42(4), pp. 608-616, December 1993.

Reliability Evaluation of Plastic Encapsulated Parts

L. Weil, M. Pecht and E. Hakim

Abstract:

This paper compares the failure rates of several families of plastic encapsulated microcircuits (PEMs) using both field & test data (test data are converted to device failure rates for field conditions using common acceleration equations) and Mil-Hdbk-217 calculations. Calculated failure rates are obtained from the Mil-Hdbk-217F for both plastic encapsulated and ceramic hermetic class-B microcircuits. Comparisons show that the results from Mil-Hdbk-217 are misleading and that the US military and Government part-selection methods should not be burdened by this -217 methodology.
 

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