IEEE Transactions on Reliability, Vol. 42(4), pp. 608-616, December 1993.

Reliability Evaluation of Plastic Encapsulated Parts

L. Weil, M. Pecht and E. Hakim


This paper compares the failure rates of several families of plastic encapsulated microcircuits (PEMs) using both field & test data (test data are converted to device failure rates for field conditions using common acceleration equations) and Mil-Hdbk-217 calculations. Calculated failure rates are obtained from the Mil-Hdbk-217F for both plastic encapsulated and ceramic hermetic class-B microcircuits. Comparisons show that the results from Mil-Hdbk-217 are misleading and that the US military and Government part-selection methods should not be burdened by this -217 methodology.

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