1993 U.S. Conference on GaAs Manufacturing TECHnology, Atlanta, GA, May 16-19, 1993.

Experimental And Theoretical Investigation Of Die Attach Manufacturing Variables And Thermo-Mechanical Performance Of Gaas Mmics On LTCC Substrates
A. Chritou, and D. Barker


The effect of die attach processing parameters on MMIC channel temperatures and die thermo-mechanical reliability has been investigated.  MMIC power amplifiers from two commercial suppliers were utilized in the investigation.  The die attach material was AuSn and AuSi while the substrate was LTCC (Low Temperature Co-fired Ceramic, SiO2, Al2O3).  A comparison of die attach integrity of LTCC and alumina substrates was also carried out.  Channel temperatures and thermal surface distributions were determined by scanning infrared microscope (SIM), while the die attach/substrate interface was investigated with scanning acoustic microscopy (SAM).  The GaAs MMIC die size dependence was investigated by varying the die size from 200x200 mils, 300x500 mils to 500x500 mils to 200x500 mils (four unseparated MMICs).  Three different attach heights were also investigated: 0.5 mil, 1.0 and 3.0 mils, in order to determine the thickness dependence.

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