Experimental And Theoretical Investigation Of Die
Attach Manufacturing Variables And Thermo-Mechanical Performance Of Gaas
Mmics On LTCC Substrates
A. Chritou, and D. Barker
The effect of die attach processing parameters on MMIC channel temperatures
and die thermo-mechanical reliability has been investigated. MMIC
power amplifiers from two commercial suppliers were utilized in the investigation.
The die attach material was AuSn and AuSi while the substrate was LTCC
(Low Temperature Co-fired Ceramic, SiO2, Al2O3). A comparison of
die attach integrity of LTCC and alumina substrates was also carried out.
Channel temperatures and thermal surface distributions were determined
by scanning infrared microscope (SIM), while the die attach/substrate interface
was investigated with scanning acoustic microscopy (SAM). The GaAs
MMIC die size dependence was investigated by varying the die size from
200x200 mils, 300x500 mils to 500x500 mils to 200x500 mils (four unseparated
MMICs). Three different attach heights were also investigated: 0.5
mil, 1.0 and 3.0 mils, in order to determine the thickness dependence.
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