Solid State Technology, September 1993.

An Overview Of Multichip Modules

P. Lall and S. Bhagath


Multichip packaging provides one means of achieving high chip densities, shorter interconnection lengths, and improved IC system performance.  This paper provides and overall perspective of multichip module (MCM) capabilities, size, speed, applications, materials, manufacturing, and cost.

Complete article is available to CALCE Consortium Members.


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