Design Approach To Reliable Microelectronic Packages
CALCE Electronics Packaging Research Center
University of Maryland, College Park, 20742
Aberdeen Proving Ground, MD
Army Research Laboratory
Fort Monmouth, NJ 07703-5302
This paper discusses some of the challenges associated with design for
reliability of microelectronic packages. A physics-of-failure approach
to proactive design for reliability is presented and implementation of
a failure model library is explained.
Complete article is available to CALCE Consortium Members.