Design Approach To Reliable Microelectronic Packages
M. Pecht
CALCE Electronics Packaging Research Center
University of Maryland, College Park, 20742
M. Cushing,
Army, AMSAA
Aberdeen Proving Ground, MD
E. Hakim
Army Research Laboratory
Fort Monmouth, NJ 07703-5302
Summary:
This paper discusses some of the challenges associated with design for
reliability of microelectronic packages. A physics-of-failure approach
to proactive design for reliability is presented and implementation of
a failure model library is explained.
Complete article is available to CALCE Consortium Members.