Proceedings 9th European Hybrid Microelectronics Conference,
pp. 484-492, Nice, France, June2-4 1993.

Design Approach To Reliable Microelectronic Packages

M. Pecht
CALCE Electronics Packaging Research Center
University of Maryland, College Park, 20742

M. Cushing,
Aberdeen Proving Ground, MD

E. Hakim
Army Research Laboratory
Fort Monmouth, NJ 07703-5302


This paper discusses some of the challenges associated with design for reliability of microelectronic packages.  A physics-of-failure approach to proactive design for reliability is presented and implementation of a failure model library is explained.

Complete article is available to CALCE Consortium Members.

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