Abstract:

A generalized stress analysis model is presented to analyze the stresses in J-leaded solder joints under thermo-mechanical loading.  A Rayleigh-Ritz energy method is used to estimate the stresses and strains due to global CTE mismatch between the substrate and the component, and a one-dimensional eigen-function solution is used to estimate the stresses and strains due to local CTE mismatch between the lead and the solder.  The total elastic field is obtained by superposition.  The purpose of this unified stress analysis technique is to permit future studies of plastic and creep deformations in the solder joint, with the eventual aim of performing fatigue studies under thermo-mechanical cyclic loading.
 

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