A Generalized Stress Analysis Model For Fatigue Prediction Of Surface Mount Solder Joints
A. Dasgupta, S. Ling and S. Verma
A generalized stress analysis model is presented to analyze the stresses
in J-leaded solder joints under thermo-mechanical loading. A Rayleigh-Ritz
energy method is used to estimate the stresses and strains due to global
CTE mismatch between the substrate and the component, and a one-dimensional
eigen-function solution is used to estimate the stresses and strains due
to local CTE mismatch between the lead and the solder. The total
elastic field is obtained by superposition. The purpose of this unified
stress analysis technique is to permit future studies of plastic and creep
deformations in the solder joint, with the eventual aim of performing fatigue
studies under thermo-mechanical cyclic loading.
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