ASME Journal of Electronic Packaging, Vol. 115, pp. 404-409, December 1993.

Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance

S. Bhagath and M. Pecht


This paper presents the development of an initial, "first-cut", mathematical model for the prediction of electrical interface reliability trends.  The model pertains to gold plated contacts subject to loss of normal force and environmental corrosion with time.  Stress relaxation over time and temperature in the base metal of the contact is accounted for.  Utilizing the results of Mixed Flowing Gas (MFG) tests, the model can be used to estimate the statistical contact resistance at a particular load (normal force), aging and operating temperature in the class II and III environments.  An attempt is made to correlate experimental data with the classical Holm's equation and to introduce time dependence into the equation.  Further work is proposed to correlate results with experimental connector performance data.

Complete article is available to CALCE Consortium Members.

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