Reliability Evaluation of Simple Logic Microcircuits in Surface Mount Plastic Packages
L. Condra, G. Wenzel, and M. Pecht
Electronic Packaging Reliability, EEP-Vol. 6, pp. 85-100, November 1993
Sixteen hundred samples representing three different part numbers form
four different suppliers were assembled onto circuit cards and tested in
accelerated environments. Each sample was exposed to a combination
of temperature cycling, temperature-humidity-bias, and vibration as defined
by a Taguchi array of stress factors. This paper discusses the reliability
results after testing through 2,000 temperature cycles, 3,000 hours of
temperature-humidity-bias, and vibration.
article is available to CALCE Consortium Members.