Reliability Evaluation of Simple Logic Microcircuits in Surface Mount Plastic Packages

L. Condra, G. Wenzel, and M. Pecht
Electronic Packaging Reliability, EEP-Vol. 6, pp. 85-100, November 1993


Sixteen hundred samples representing three different part numbers form four different suppliers were assembled onto circuit cards and tested in accelerated environments.  Each sample was exposed to a combination of temperature cycling, temperature-humidity-bias, and vibration as defined by a Taguchi array of stress factors.  This paper discusses the reliability results after testing through 2,000 temperature cycles, 3,000 hours of temperature-humidity-bias, and vibration.

Complete article is available to CALCE Consortium Members.

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