A Numerical Study Of Fatigue Life Of J-Leaded Solder Joints Using The Energy Partitioning Approach
S. Verma, A. Dasgupta and D. Barker
A surface-mount J-leaded device is modeled in this study, to investigate
the effects of selected design, loading and manufacturing variables on
solder joint fatigue life. The solder is modeled as a viscoplastic
material, while the remaining materials are assumed to be linear elastic,
as a first order approximation. Finite element analysis is used to
determine the stress and strain history in the solder, due to temperature
cycling. A "typical" temperature cycle with uniform dwell periods
is applied to the solder joint. The computed stress and strain history
utilized to construct hysteresis plots at each location in the solder joint.
The hysteresis plots are then partitioned into elastic strain energy, plastic
work and creep work dissipation. The fatigue life of the solder joint
is then estimated through the energy partitioning technique. Parametric
studies are conducted to investigate qualitatively the dependence of solder
joint fatigue life on selected material properties, geometric variables,
life cycles as well as accelerated loads, and manufacturing variability.
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