Advances in Electronic Packaging ASME EEP, Vol. 4, No. 1, 1993.
also ASME International Electronic Packaging Conference, Binghamton, NY, Sept. 29-Oct. 2, 1993.

An Integrated Physics-Of-Failure Approach To Reliability Assessment

P. Lall and M. Pecht


A physics-of-failure approach has been developed and implemented in software for reliability assessment and derating of multichip modules based on device architecture, environmental and test loads, and device mission life.  The motivation for this project, the approach taken and the implementation impact are discussed in this paper.

Complete article is available to CALCE Consortium Members.

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