Advances in Electronic Packaging ASME EEP, Vol. 4, no. 2, 1993.

A Design Model For Through-Hole Components Based On Lead-Fatigue Considerations

S. Ling and A. Dasgupta


Fatigue failures are known to occur in leads of insertion mount components, when electronic printed circuit assemblies are subjected to severe vibration loads.  As a result, the reliability of through-hole-interconnections is reduced.  Fatigue life of leads in a through-hole package is a complex function of constitutive properties, architecture and geometry of the package, and vibration loads applied to it.  Therefore, a general and a concise method can be utilized to estimate the fatigue life of leaded through-hole components is not only desired, but also crucial.  The main objective of the present study is to formulate a mode, based on energy principles, to analyze fatigue endurance of leads in a through-hole package.  The hole is to formulate a design tool, which can be used to examine the influence of material and geometric variables on fatigue life of leads in through-hole electronic packages.

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