A Design Model For Through-Hole Components Based On Lead-Fatigue Considerations
S. Ling and A. Dasgupta
Fatigue failures are known to occur in leads of insertion mount components,
when electronic printed circuit assemblies are subjected to severe vibration
loads. As a result, the reliability of through-hole-interconnections
is reduced. Fatigue life of leads in a through-hole package is a
complex function of constitutive properties, architecture and geometry
of the package, and vibration loads applied to it. Therefore, a general
and a concise method can be utilized to estimate the fatigue life of leaded
through-hole components is not only desired, but also crucial. The
main objective of the present study is to formulate a mode, based on energy
principles, to analyze fatigue endurance of leads in a through-hole package.
The hole is to formulate a design tool, which can be used to examine the
influence of material and geometric variables on fatigue life of leads
in through-hole electronic packages.
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