Thermal Derating Guidelines for Temperature-Tolerant Design of Micro-Eletronic Devices
P. Lall, M. Pecht and E. Hakim
Existing thermal derating criteria for microelectronic devices involve
lower steady state temperature. This approach to derating typically
involves lowering temperature as a dominant in expectation of improved
reliability based on the assumption that steady state temperature is the
dominant accelerator for the dominant failure mechanisms. To make
the accountability of derating criteria to failure accelerating stresses
more generic, a physics-of-failure approach has been devised to account
for the dominant failure mechanisms and the accelerating stresses.
An example application of the approach has been discussed.
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