Existing thermal derating criteria for microelectronic devices involve lower steady state temperature.  This approach to derating typically involves lowering temperature as a dominant in expectation of improved reliability based on the assumption that steady state temperature is the dominant accelerator for the dominant failure mechanisms.  To make the accountability of derating criteria to failure accelerating stresses more generic, a physics-of-failure approach has been devised to account for the dominant failure mechanisms and the accelerating stresses.  An example application of the approach has been discussed.
 

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