Plastic Packages Microcircuits: Quality, Reliability, Reliability and Cost Issues
M. Pecht, R. Agarwal, and D. Quearry
Plastic encapsulated microcircuits (PEMs) find their main application
in commercial and telecommunication electronics. The advantages of
PEMs in cost, size, weight, performance, and market lead time, have attracted
97% of the market share of worldwide microcircuit sales. However,
PEMs have always been resisted in US Government and military applications
due to the perception that PEM reliability is low. This paper surveys
plastic packaging with respect to the issues of reliability, market lead-time,
performance, cost, and weight as a means to guide part-selection and system-design.
article is available to CALCE Consortium Members.
© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.