Computer Aided Design And Reliability Assessment Of Microelectronic Packages
P. Lall, C. Rust, X. Shan, and E. Hakim
Software tools, which implement the physics-of-failure approach, have
been developed for design and reliability assessment of multichip modules
based on device architecture, environmental and test loads, and device
mission life. The physics-of-failure approach addresses the damage
physics of the failure phenomena in microelectronic devices, and is an
alternative to empirical handbooks which involve the collection of field
failure data and extrapolation of such data to obtain reliability estimates.
The software tools developed, address the shortcomings of empirical methods.
The structure of the software tools has been devised to address generic
package architecture and materials. Some of the features of these
software tools are discussed.
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