Abstract:

A die attach assembly in a microelectronics package experiences various stresses during manufacture, test, storage, and operation.  Due to micro-cracks, voids, or other defects in the die or attachment materials, these stresses can cause component failure through various failure mechanisms.  Therefore, to achieve reliable die attach, industry requires a practical set of design guidelines.  This paper addresses the potential failure mechanisms of die attach assemblies, analyzes thermo-mechanical stresses, and presents a design approach based on the physics of failure models.