Design Of Reliable Die Attach
J. Hu, M. Pecht, and A. Dasgupta
A die attach assembly in a microelectronics package experiences various
stresses during manufacture, test, storage, and operation. Due to
micro-cracks, voids, or other defects in the die or attachment materials,
these stresses can cause component failure through various failure mechanisms.
Therefore, to achieve reliable die attach, industry requires a practical
set of design guidelines. This paper addresses the potential failure
mechanisms of die attach assemblies, analyzes thermo-mechanical stresses,
and presents a design approach based on the physics of failure models.