The International Society for Hybrid Microelectronics, Vol. 16, No. 3,  pp. 217-240, 1993.

An Approach to the Development of Package Design Guidelines

M. Pecht, D. Barker, and A. Dasgupta


This paper presents an approach to the development of design guidelines for integrated circuits, hybrid, and multichip packages. The approach is based on the physics of failure principles. The paper discusses key design constraints and design goals. A flow chart of design activities is presented. The goal is to develop a packaging architecture that incorporated information ranging from the dies to be packaged to the package-mounting platform (i.e., circuit card) using compatible materials, interfaces, and geometric configurations based on tradeoffs between competing goals, tolerances, and constraints.

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