An Approach to the Development of Package Design Guidelines
M. Pecht, D. Barker, and A. Dasgupta
This paper presents an approach to the development of design guidelines
for integrated circuits, hybrid, and multichip packages. The approach is
based on the physics of failure principles. The paper discusses key design
constraints and design goals. A flow chart of design activities is presented.
The goal is to develop a packaging architecture that incorporated information
ranging from the dies to be packaged to the package-mounting platform (i.e.,
circuit card) using compatible materials, interfaces, and geometric configurations
based on tradeoffs between competing goals, tolerances, and constraints.
article is available to CALCE Consortium Members.