Bi-Chu Wu, Michael Pecht
University of Maryland, College Park, MD 20742
Cedar Rapids, Iowa 52498
In this paper the preliminary results of a study to characterize the conductive filament formation (often called metal migration) of woven fabric printed wiring boards with respect to resin material, board surface coating, applied bias, geometry of the electrodes and spacing between the electrodes are presented. The experiments were accelerated life tests at controlled temperature-humidity-voltage conditions.
article is available to CALCE Consortium Members.
© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.