13th IEEE Intern. Electronics Manuf. Techn. Symposium, pp. 74-79, 1992

Conductive Filament Formation in Printed Wiring Boards

Bi-Chu Wu, Michael Pecht
University of Maryland, College Park, MD 20742

Davie Jennngs
Collins Divisions
Rockwell International
Cedar Rapids, Iowa 52498


In this paper the preliminary results of a study to characterize the conductive filament formation (often called metal migration) of woven fabric printed wiring boards with respect to resin material, board surface coating, applied bias, geometry of the electrodes and spacing between the electrodes are presented. The experiments were accelerated life tests at controlled temperature-humidity-voltage conditions.

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