13th IEEE/CHMT International Electronics Manuf. Technology Sym., Baltimore, MD, pp. 19-29, Sept. 28-30, 1992

Towards a QML Approach in Electronic Packaging

A. Dasgupta, S. Verma, and R. Agarwal
University of Maryland
College Park, MD 20742


This paper discusses the importance of scientific product validation, process verification and control, as essential subtasks in an integrated QML approach to reliable electronic packaging. The distinctions between product validation and process verification functions are defines. A generic and unified approach is presented for product validation tasks. The role of analysis, simulation and testing in design model development and product validation is qualitatively discussed. Tools are presents to hierarchize the influence of the various design and manufacturing variable on product reliability, quality, yield and life-cycle cost. Case studies are presented to illustrate applications of the main concepts.

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