Proceedings IEEE Multichip Module Conference , pp. 106-109, March 18-20, 1992.

Effect Of Humidity Cycling On Reliability Of Overlaid High Density Interconnects

X. Shan, R. Agarwal, M. Pecht, and J. Evans


This paper presents a finite element simulation, performed to observe the stresses generated in a typical HDI structure as a result of "swelling" mismatches due to water absorption.  The focus is on potential stress concentration sites in the polyimide layer.

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