Evaluation Of Manufacturing Variables In The Reliability Of Surface Mount Capacitors
L. Condra, G. Johnson, M. Pecht, and A. Christou
The reliability of surface mount capacitors assembled under a variety
of conditions has been evaluated in temperature cycling, vibration, altitude,
and temperature humidity bias (THB) environments. Both initial assembly
(vapor phase) and rework processes were used to assemble capacitors to
alumina substrates, with the following variables: assembly thermal conditions,
capacitor manufacturer, conformal coating materials, and number of assembly
cycles. Failure rates were higher for the rework process than for
the initial assembly cycles. Failure rates were higher for the rework
process than for the initial assembly process. The failures observed
in environmental testing correlated well with earlier scanning laser acoustic
microscopy (SLAM) testing on capacitors prior to assembly, and SLAM testing
has been implemented as a screen for incoming capacitors.
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