ASME Winter Annual Meeting, Anaheim, CA, November 8-13, 1992
Fatigue Life of Misregistered J-Lead Solder Joints Through an Energy-Partitioning Analysis
A. Dasgupta, S. Verma, and D. Barker
University of Maryland
College Park, MD
A surface-mount J-leaded device is modeled in this study, for investigating
the effects of component misregistration on solder joint fatigue life.
Finite element analysis is used to determine the stress and strain history
in the solder, due to temperature cycling. The solder is modeled
as a viscoplastic material, while the remaining materials are assumed to
be linear elastic, as a first order approximation. A “typical?temperature
cycle with uniform dwell periods is applied to the solder joint.
The computed stress and strain histories are utilized to construct hysteresis
plots at each location in the solder joint. The hysteresis plots
are then partitioned into elastic strain energy, plastic work and creep
work dissipation. The fatigue life of the solder joint is then estimated
through an energy partitioning technique proposed by the authors in an
earlier paper, based on fatigue data for eutectic Sn/Pb solder obtained
from the open literature. The amount of misregistration is varied
systematically, and fatigue life plots of the solder joint are produced
for each solder geometry. The effect of component misregistration
on solder fatigue life is thus estimated through systematic parametric
article is available to CALCE Consortium Members.