A surface-mount J-leaded device is modeled in this study, for investigating the effects of component misregistration on solder joint fatigue life.  Finite element analysis is used to determine the stress and strain history in the solder, due to temperature cycling.  The solder is modeled as a viscoplastic material, while the remaining materials are assumed to be linear elastic, as a first order approximation.  A “typical?temperature cycle with uniform dwell periods is applied to the solder joint.  The computed stress and strain histories are utilized to construct hysteresis plots at each location in the solder joint.  The hysteresis plots are then partitioned into elastic strain energy, plastic work and creep work dissipation.  The fatigue life of the solder joint is then estimated through an energy partitioning technique proposed by the authors in an earlier paper, based on fatigue data for eutectic Sn/Pb solder obtained from the open literature.  The amount of misregistration is varied systematically, and fatigue life plots of the solder joint are produced for each solder geometry.  The effect of component misregistration on solder fatigue life is thus estimated through systematic parametric studies.
 

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