Proceedings 1992 Surface Mount Technology and Modern Circuit Making Conference, April 13-16, 1992, pp. 101-120
D. Wolfovitz and D. Barker
CALCE EPSC
University of Maryland
College Park, MD 20742
Abstract:
The purpose of this paper is to guide the manufacturing and design engineer
through the different manufacturing steps and clearly point out the root
cause of the various manufacturing defects and flaws while providing corrective
action. Various tables are presents for the different manufacturing steps
which list the flaw or defect, the root cause, and the corrective action.
It is hoped that through a better understanding of the root cause of the
various manufacturing defects, packaging, and production engineers will
become less fearful of FPCs and start to look at them as a viable alternative
to rigid boards and wiring harness to solve modern packaging problems.
Complete
article is available to CALCE Consortium Members.