| Created: 6/26/98 | Updated: 8/10/99 |
Design Guidelines For Leads Of Microelectronic Packages
A. Arora, M. Pecht, and A. Dasgupta
This paper describes the advantages and limitations of various lead
materials, followed by a description of lead failure mechanisms.
Guidelines for design of leads are then presented, and recommended procedures
for quality assurance and life tests for leads are outlined. The
study is part of a two year research program titled "Reliable IC Package
Design Guidelines", funded by Rome Laboratory (previously RADC).
Complete
article is available to CALCE Consortium Members.