Created: 6/26/98 Updated: 8/10/99

Proceedings 1992 Surface mount Technology and Modern Circuit Making Conference,
April 13-16, 1992, pp. 89-100

Design Guidelines For Leads Of Microelectronic Packages

A. Arora, M. Pecht, and A. Dasgupta


This paper describes the advantages and limitations of various lead materials, followed by a description of lead failure mechanisms.  Guidelines for design of leads are then presented, and recommended procedures for quality assurance and life tests for leads are outlined.  The study is part of a two year research program titled "Reliable IC Package Design Guidelines", funded by Rome Laboratory (previously RADC).

Complete article is available to CALCE Consortium Members.

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