Cooling Of Electronic Boards Using Internal Fluid Flows
K. Herold, S. Sridgar, and S. Hu
Advances in electronic component miniaturization have progressed faster
than reductions in power dissipation. This results in higher power
dissipation on a typical board. Current typical average power densities
of 0.1 W/cm2 (over an entire board) are predicted to grow to as high as
1.0 W/cm2 within a few years. Such high power densities require designers
to consider active cooling options. Many alternative cooling options
have been considered to solve the thermal problem. One option is
forced convection cooling with an internal flow. A typical internal
flow configuration is to vacuum braze a fin structure between aluminum
plates. The printed wire boards are then mounted to both sides of
this heat sink structure. The coolant, either gas of liquid, is then
passed through the finned cavity. For air-cooled modules, significant
design data are available in the literature. A comparison of predicted
heat transfer performance obtained from simulation is made against recent
experimental data on air cooled boards to validate the model. For
liquid cooled systems, the available design data are largely proprietary.
An experimental program aimed at measuring the performance of liquid cooled
systems is described and preliminary data are presented.
article is available to CALCE Consortium Members.