Journal of Heat Transfer, Vol. 114, May 1992
S. Sathe and Y. Joshi
University of Maryland
College Park, MD 20742
The coupled conduction transport from a substrate-mounted heat generating
protrusion in a liquid-filled square enclosure is numerically examined.
The governing steady two-dimensional equations are solved using a finite-difference
method for a wide range of Rayleigh numbers, protrusion thermal conductivities
and widths, substrate heights, and enclosure boundary conditions.
The results presented apply to liquids with 10? Pr ? 1000. It was
established that in many situations it may be inappropriate to specify
simple boundary conditions on the solid surface and decouple the conduction
within the substrate or the protrusion thermal conductivities, and widths
enhanced cooling. A variation in the substrate height did not affect
the maximum protrusion temperature; however, the flow behavior was considerably
altered. An empirical correlation for the maximum protrusion temperature
was developed for a wide range of parametric values. The enclosure
thermal boundary conditions changed the heat transfer in the solid region
to only a small extent. Immersion cooling in common dielectric liquids
was shown to be advantageous over air cooling only if the thermal conductivity
of the protrusion was larger than that of the liquid.
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