Journal of Electronic Packaging, Vol. 114, September 1992
University of Maryland
College Park, MD 20742
Traditionally, placement techniques have focused on improving routability
based on minimizing the total wire length between interconnected components.
However, electronic card assembly (ECA) reliability, which is measured
in terms of time to failure, cycles to failure, or the hazard rates of
the individual components, the interconnections, and the PWB, is also affected
by component placement. This paper discusses component placement
for reliability based operating temperature, a threshold temperature, and
change in temperature. Placement procedures are developed so as to
minimize the time to failure or the total hazard rate of the components
on a PWB utilizing a forced convection cooling
article is available to CALCE Consortium Members.