Composite Materials In Electronic Packaging
This paper presents an overview of the different applications of composite
materials in current electronic packaging technology. The main goal
of this paper is to identify the major design challenges facing users of
these advanced materials and to present an overview of the modeling techniques
currently available to designers for modeling the performance and failure
characteristics of there systems. Example applications include particulate
composites such as reinforced adhesives, solders, and SiC-reinforced metal-matrix
cases. Anisotropic continuous-fiber reinforced composites such as
graphite-reinforced metal-matrix heat sinks and composite boxes/racks designed
for EMI shielding. Laminated plate composites such as multi-layered
substrate and board materials. And woven-fabric composites such as
those used for electronic PWBs.
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