Abstract:

This tutorial illustrates designs where brittle fracture can endanger system performance, thereby acting as an overstress failure mechanism.  Analytic (physics-of-failure) methods, based on continuum fracture-mechanics rather than on molecular micro-mechanics, are presented to design against such failures.  The associated stress-analysis techniques and material characterizations have matured appreciably over the past 40 years and are routinely used in aerospace, automotive, and other mechanical/structural applications.  Two examples illustrate the use of these models in practical electronic packaging.
 

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