IEEE Transactions on Reliability, Vol. 41, No. 3, September, 1992

Failure Mechanism Models for Brittle Fracture

A. Dasgupta, and J. Hu
University of Maryland
College Park, MD


This tutorial illustrates designs where brittle fracture can endanger system performance, thereby acting as an overstress failure mechanism.  Analytic (physics-of-failure) methods, based on continuum fracture-mechanics rather than on molecular micro-mechanics, are presented to design against such failures.  The associated stress-analysis techniques and material characterizations have matured appreciably over the past 40 years and are routinely used in aerospace, automotive, and other mechanical/structural applications.  Two examples illustrate the use of these models in practical electronic packaging.

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