IEEE Transactions on Reliability, Vol. 41, No. 3, September, 1992
Failure Mechanism Models for Brittle Fracture
A. Dasgupta, and J. Hu
University of Maryland
College Park, MD
This tutorial illustrates designs where brittle fracture can endanger
system performance, thereby acting as an overstress failure mechanism.
Analytic (physics-of-failure) methods, based on continuum fracture-mechanics
rather than on molecular micro-mechanics, are presented to design against
such failures. The associated stress-analysis techniques and material
characterizations have matured appreciably over the past 40 years and are
routinely used in aerospace, automotive, and other mechanical/structural
applications. Two examples illustrate the use of these models in
practical electronic packaging.
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