Two Dimensional Thermal Modeling of Power Monolithic Microwave Integrated Circuits (MMICs)
M. Fan, A. Chrstou, and M. Pecht
Numerical simulations of the two-dimensional temperature distributions
for a typical GaAs MMIC circuit are conducted, aiming at understanding
the heat conduction process of the circuit chip and providing temperature
information for device reliability analysis. The method used is to
solve the two-dimensional heat conduction equation with a control-volume-based
finite difference scheme. In particular, the effects of the power
dissipation and the ambient temperature are examined, and the criterion
for the worst operating environment is discussed in terms of the allowed
highest device junction temperature.
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