Proceedings of 1991 Spring Meeting of the Material Research Society

Experimental Evaluation Of Mechanical Behavior Of GaAs Wafer Material

J. Ju, M. Pecht, and D. Barker
University of Maryland
College Park, MD 20742


The mechanical behavior of non-metalized GaAs, included wafer material at different temperatures were evaluated.  The material properties of GaAs, including the modulus of elasticity, the modulus of rupture, the critical value of stress intensity factor, and the coefficient of thermal expansion, were experimentally determined over various temperature ranges.

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