Proceedings of the Nepcon East, pp. 569-576, June 1991

A Tool for Evaluating Performance and Technology Tradeoffs in Integrated Circuit Packaging

P. Sandborn
University of Maryland
College Park, MD 20742


This paper describes a software tool for enhancing the manufacturability and decreasing the design risk associated with the selection of packaging technologies for integrated circuits. The system is intended to be used before, during, and after prototype design and fabrication of multichip packaging systems to provide design-specific performance estimations. Geometric, electrical, thermal, and manufacturing metrics can be estimated. Output from the tool can be used to predict optimum technology mixes and provide constraints needed by CAD placement and routing tools.

Complete article is available to CALCE Consortium Members.

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