University of Maryland
College Park, MD 20742
This paper describes a software tool for enhancing the manufacturability
and decreasing the design risk associated with the selection of packaging
technologies for integrated circuits. The system is intended to be used
before, during, and after prototype design and fabrication of multichip
packaging systems to provide design-specific performance estimations. Geometric,
electrical, thermal, and manufacturing metrics can be estimated. Output
from the tool can be used to predict optimum technology mixes and provide
constraints needed by CAD placement and routing tools.
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