A Probabilistic Approach For Predicting Thermal Fatigue Life Of Wire Bonding In Microelectronics
J. Hu, M. Pecht, and A. Dasgupta
Wire bond connections are susceptible to fatigue failure as a result
of various thermo-mechanical damage mechanisms during the component operation
life. Because of uncertainties arising from the random nature of
temperature fluctuations, the assembly of wire bonds, and fatigue properties
of bonding materials, probabilistic analysis and reliability estimations
are appropriate. This paper presents such an approach for predicting
thermal fatigue life and reliability of wire bonds in electronic packages.
To determine the behavior of wire bonds under thermal cycles, the stress
amplitude due to the temperature fluctuation in each fatigue failure mechanism
is derived based on stress analysis models, the uncertainties involved
in stress determination and life prediction are analyzed, and a life prediction
equation is proposed. Examples illustrating the application of the
approach are discussed.
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