The International Journal for Hybrid Microelectronics, Vol. 14, No. 3, pp. 83-95, Sept. 1991.

Prediction of PWB/PCB Thermal Conductivity

R. Agarwal, A. Dasgupta, M. Pecht and D. Barker


Models are proposed to predict the orthotropic thermal conductivity of woven fabric reinforced composite laminates used as printed wiring board (PWB) substrates. Fabric weave geometry, fiber volume fraction, and constituent material thermal conductivities constitute the inputs to the prediction models. Results obtained from the models are presented in graphical form to facilitate designers in selecting a laminate based on thermal characteristics and the associated tradeoffs. The predicted thermal conductivities for various PWB laminate materials are found to compare well with three-dimensional finite element analyses and with experimental values.

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