The International Journal for Hybrid Microelectronics, Vol. 14, No. 3, pp. 83-95, Sept. 1991.
Prediction of PWB/PCB Thermal Conductivity
R. Agarwal, A. Dasgupta, M. Pecht and D. Barker
Models are proposed to predict the orthotropic thermal conductivity
of woven fabric reinforced composite laminates used as printed wiring board
(PWB) substrates. Fabric weave geometry, fiber volume fraction, and constituent
material thermal conductivities constitute the inputs to the prediction
models. Results obtained from the models are presented in graphical form
to facilitate designers in selecting a laminate based on thermal characteristics
and the associated tradeoffs. The predicted thermal conductivities for
various PWB laminate materials are found to compare well with three-dimensional
finite element analyses and with experimental values.
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