S. Sathe and Y. Joshi
University of Maryland
College Park, MD 20742
An investigation of natural convection flow and heat transfer arising from a substrate-mounted protruding heat source immersed in a liquid-filled square enclosure is reported. The model considers heat transfer within the protrusion and substrate and the coupled natural convection in the fluid. Numerical predictions are obtained for a wide range of appropriate Rayleigh and Prandtl numbers and substrate to fluid thermal conductivity ratios that may be encountered in liquid-immersion cooling of electronic components. For many situations of interest prescribing simplistic heat transfer conditions at the solid surfaces is found inappropriate. Increasing the Rayleigh number beyond 106 and the substrate thermal conductivity beyond 100 times that of the liquid produces only a marginal decrease in the maximum temperatures. Computed protrusion surface temperature compare favorably with available experimental temperatures. Computed protrusion surface temperatures compare favorably with available experimental results for a similar configuration.
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