True Temperature Measurement of Couples Devices Using Infrared Thermography
C. Lamb, G. Braunberg, and M. Pecht
Infrared (IR) techniques can be used to determine the true full-field
temperature of a complex device non intrusively, instead of using thermocouples.
Accurate IR temperature estimation usually requires that the device's temperature
be well above the background temperature and that the device be composed
of objects or regions with known emissivities. Because these assumptions
do not generally hold true for electronic circuit assemblies (ECAs), a
method must be devised to minimize the effects of the background and compensate
for nonuniform and unknown emissivities of the materials that comprise
the ECA. This technique can ultimately be applied to improve the thermal
ECA layout, investigate aging of components, and detect damaging conditions.
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