Abstract:

Infrared (IR) techniques can be used to determine the true full-field temperature of a complex device non intrusively, instead of using thermocouples. Accurate IR temperature estimation usually requires that the device's temperature be well above the background temperature and that the device be composed of objects or regions with known emissivities. Because these assumptions do not generally hold true for electronic circuit assemblies (ECAs), a method must be devised to minimize the effects of the background and compensate for nonuniform and unknown emissivities of the materials that comprise the ECA. This technique can ultimately be applied to improve the thermal ECA layout, investigate aging of components, and detect damaging conditions.
 

Complete article is available to CALCE Consortium Members.