Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering
D. Barker, M. Pecht, A. Dasgupta, and S. Naqvi
During a typical wave soldering operation a plated through hole (PTH)
is exposed to temperatures which are higher than any rated operating temperatures.
Understanding the heat transfer and the potential PTH damage mechanisms,
which arise during the wave soldering process, is critical to PTH quality
control and reliability. In particular, cracks may be initiated during
the wave soldering transient and become manifest only after operational
cycling. This paper presents a transient nonlinear thermal stress
analysis of a non-solder-filled PTH that is subjected to a typical wave
soldering process. A full three-dimensional orthotropic analysis
and an axisymmetric analysis with cylindrically anisotropic properties
are used and the results compared. Temperature and stress/strain
history curves are examined to determine the impact of the wave soldering
operation on the PTH fatigue life. The effect of PWB inner planes
on the PTH maximum stress and strain is also investigated.
article is available to CALCE Consortium Members.