Y. Joshi and R. Paje
University of Maryland
College Park, MD 20742
An experimental investigation of natural convection heat transfer from
a commercially available semiconductor device package substrate assembly
formed one surface of a dielectric liquid filled cubical enclosure of side
4.6 cm. The surface facing the package substrate combination was
maintained at a uniform temperature and acted as the heat sink while the
remaining enclosure walls were insulated. Temperature measurements
were made at the chip center, the package lid and several locations on
the substrate. Baseline measurements are reported first for air-cooling.
Results are then presented for three dielectric liquids and three temperatures
of the cold wall, both with the substrate oriented horizontally, as well
as vertically. With the cold wall that is maintained at 15ºC
it was found that the maximum input power without exceeding a chip of 80ºC
was about 1.9W with FC-75 as the coolant.
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