Journal of Electronic Packaging, Vol. 112, September 1990.

A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation

M. Pecht and C.H. Tan


A zonal decomposition technique is developed for temperature field and flux determination at both aligned and non aligned grid interface boundaries. The method facilitates heat transfer problems commonly encountered in electronics including PWBs with multiple irregular boundaries in which numerical generation of boundary-fitted coordinates is required. To demonstrate the applicability and performance of the method, a 2-D heat conduction problem in Cartesian coordinates, a 2-D heat conduction problem in curvilinear coordinates, and a 3-D heat conduction problem in curvilinear coordinates are solved. Comparisons between numerical and analytical results are shown to be in excellent agreement.

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