Michael Osterman and Michael Pecht
University of Maryland
College Park, MD 20742
This paper develops a couple reliability and routability placement procedure for arranging electronic components on a convectively cooled two-dimensional workspace. The placement procedures for reliability are based on a priority metric derived from a temperature dependent failure rate equation and heat transfer equations for a single row of convectively cooled components. Coupling of placement for reliability and routability is presented through the novel application of force-directed placement techniques.
Keywords - Component placement, forced-directed placement, routing, reliability, convection cooling.
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