Abstract:

As integrated circuit geometries become smaller and package sizes and E/O counts increase, there is an increased potential of failures resulting from moisture ingress and corrosion.  To aid in reliability prediction, design for reliability, and assessing reliability tradeoffs, a methodology for coupling the mechanisms of moisture ingress and corrosion in microelectronic packages into a first-order failure rate model is presented.  The model focuses on aluminum metallization corrosion resulting from chlorine-based contaminants, but is general enough to be applied to other cases.
 

Complete article is available to CALCE Consortium Members.

© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.