A Model For Moisture Induced Corrosion Failures In Microelectronic Packages
As integrated circuit geometries become smaller and package sizes and
E/O counts increase, there is an increased potential of failures resulting
from moisture ingress and corrosion. To aid in reliability prediction,
design for reliability, and assessing reliability tradeoffs, a methodology
for coupling the mechanisms of moisture ingress and corrosion in microelectronic
packages into a first-order failure rate model is presented. The
model focuses on aluminum metallization corrosion resulting from chlorine-based
contaminants, but is general enough to be applied to other cases.
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