IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 2, June 1990.

A Model For Moisture Induced Corrosion Failures In Microelectronic Packages

M. Pecht


As integrated circuit geometries become smaller and package sizes and E/O counts increase, there is an increased potential of failures resulting from moisture ingress and corrosion.  To aid in reliability prediction, design for reliability, and assessing reliability tradeoffs, a methodology for coupling the mechanisms of moisture ingress and corrosion in microelectronic packages into a first-order failure rate model is presented.  The model focuses on aluminum metallization corrosion resulting from chlorine-based contaminants, but is general enough to be applied to other cases.

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