Fatigue Analysis of a Planarpak Surface Mount Component
J. Sharif, D. Barker, A. Dasgupta, and M. Pecht
This paper discusses the thermo-mechanical fatigue life analysis of
an analog Avatek Planarpak surface mount device. The critical thermal
stresses and strains are analyzed with the help of two and three dimensional
finite element models. The effect of solder voids and incomplete
bonding is also investigated. Fatigue life estimations are determined
using a generalized form of the Manson-Coffin equation.
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