Presented at the Winter Annual Meeting, Dallas, Texas-November 25-30, 1990.

Fatigue Analysis of a Planarpak Surface Mount Component

J. Sharif, D. Barker, A. Dasgupta, and M. Pecht


This paper discusses the thermo-mechanical fatigue life analysis of an analog Avatek Planarpak surface mount device.  The critical thermal stresses and strains are analyzed with the help of two and three dimensional finite element models.  The effect of solder voids and incomplete bonding is also investigated.  Fatigue life estimations are determined using a generalized form of the Manson-Coffin equation.

Complete article is available to CALCE Consortium Members.

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