The International Journal for Hybrid Microelectronics, Vol. 13, No. 2, June 1990.

A Corrosion Rate Equation For Microelectronic Die Metallization

M. Pecht and W. C. Ko


The time to corrosion failure for microelectronic die metallization depends on package type, corroding material, fabrication and assembly processes, and environmental conditions.  This paper presents an electrochemical corrosion model, which couples geometric, material, assembly, operating, and environmental parameters to aid in predicting the time to uniform corrosion failure of die metallization.  The model incorporates the concepts of induction time and critical corrosion moisture content.

Complete article is available to CALCE Consortium Members.

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