A Corrosion Rate Equation For Microelectronic Die Metallization
M. Pecht and W. C. Ko
The time to corrosion failure for microelectronic die metallization
depends on package type, corroding material, fabrication and assembly processes,
and environmental conditions. This paper presents an electrochemical
corrosion model, which couples geometric, material, assembly, operating,
and environmental parameters to aid in predicting the time to uniform corrosion
failure of die metallization. The model incorporates the concepts
of induction time and critical corrosion moisture content.
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