Temperature Dependence of Micro-Electronic Device Failures
M. Pecht, P. Lall, and S. Whelan
Abstract:
Recently, the use and the applicability of reliability prediction models
for micro-electronic devices using the temperature-dependent Eyring and
Arrhenius function, have been criticized. In fact, the temperature
dependence of failure mechanisms of micro-electronic devices and electronic
equipment in general has been questioned. This paper discusses the
effect of temperature on micro-electronic failure mechanisms at various
device failure sites. This paper also presents information on those
mechanisms that may be more appropriately modeled by functions dependent
on temperature change, the rate of temperature change and spatial temperature
gradients.
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