Quality and Reliability Engineering Intl, Vol. 6, pp. 275-284, 1990.

Temperature Dependence of Micro-Electronic Device Failures

M. Pecht, P. Lall, and S. Whelan


Recently, the use and the applicability of reliability prediction models for micro-electronic devices using the temperature-dependent Eyring and Arrhenius function, have been criticized.  In fact, the temperature dependence of failure mechanisms of micro-electronic devices and electronic equipment in general has been questioned.  This paper discusses the effect of temperature on micro-electronic failure mechanisms at various device failure sites.  This paper also presents information on those mechanisms that may be more appropriately modeled by functions dependent on temperature change, the rate of temperature change and spatial temperature gradients.

Complete article is available to CALCE Consortium Members.

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