Verification of Thermal Analysis of PWBs for RAMCAD
J. Gore, M. DiMarzo, C. Resch, and M. Pecht
Thermal management of electronics is of particular importance because
of its impact on reliability. The development of models for predicting
the thermal performance of printed wiring boards (PWB) is dependent on
parameters such as thermal conductivity and heat transfer coefficients
which must be experimentally determined. Further, due to the complexity
of the PWB thermal structure, a number of assumptions and simplifications
are also necessary.
In this paper, methods involving approximate numerical solutions of the energy equations in two dimensions were developed to allow thermal management and tradeoffs to be conducted efficiently. A validation of the approximate theoretical predictions compared favorably with the experimental data using infrared thermography.
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