Proc. of ISHM '89, Baltimore, MD, pp. 607-613.

A Failure Prediction Model for Wire Bonds

M. Pecht, A. Dasgupta and P. Lall


Wire bonds in microelectronic packages connect the bond pad and associated die metallization to wires connected to the I/p leads and to other bond pads.  These connections are susceptible to failure as a result of various thermo-mechanical stresses generated during the package operating life.  In this paper the various mechanisms of wire bond failures in microelectronic packages are identified and prioritized for inclusion into a life prediction model.  A failure prediction model is then developed and the examples illustrating the use of the model are presented.

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