Abstract:

Wire bonds in microelectronic packages connect the bond pad and associated die metallization to wires connected to the I/p leads and to other bond pads.  These connections are susceptible to failure as a result of various thermo-mechanical stresses generated during the package operating life.  In this paper the various mechanisms of wire bond failures in microelectronic packages are identified and prioritized for inclusion into a life prediction model.  A failure prediction model is then developed and the examples illustrating the use of the model are presented.
 

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