A Failure Prediction Model for Wire Bonds
M. Pecht, A. Dasgupta and P. Lall
Wire bonds in microelectronic packages connect the bond pad and associated
die metallization to wires connected to the I/p leads and to other bond
pads. These connections are susceptible to failure as a result of
various thermo-mechanical stresses generated during the package operating
life. In this paper the various mechanisms of wire bond failures
in microelectronic packages are identified and prioritized for inclusion
into a life prediction model. A failure prediction model is then
developed and the examples illustrating the use of the model are presented.
article is available to CALCE Consortium Members.