ASME Winter Annual Meeting Boston, Massachusetts- December 13-18, 1987.

Placement of Integrated Circuits for Reliability on Conductivity Cooled Printed Wiring Boards

M. Osterman and M. Pecht


This article presents a mathematical theory for component placement for reliability based on the thermal response of conductivity cooled printed wiring board.  Placement procedures based on the theory are then developed and a general placement methodology is discussed.

Complete article is available to CALCE Consortium Members.

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