Molding processes produce residual stresses in encapsulated components. They are combined with the stresses caused by the coefficient of thermal expansion (CTE) mismatch to dictate the final warpage at room and reflow temperatures, which must be controlled for fabrication of redistribution layers (RDL) as well as yield during assembly. ...

6/5/2025, 11 a.m. - 12:00 p.m. US Eastern Time
Prof. Bongtae Han

On June 12, Dr. Das will discuss the impact of supply chain disruptions on the reliability practices of organizations, focusing on information management for parts and systems. In this Webinar, Dr. Das will provide examples of policy changes that can impact companies, their impacts on the supply chain, and the practices one should build to protect oneself.  

6/12/2025, 12:00 p.m. - 1:00 p.m. US Eastern Time

Dr. Damena Agonafer and Ph.D. student Vivek Manepalli have been awarded the 2025 Invention of the Year Award in the Physical Sciences for their work on Efficient Microchannel Cooling for High-powered Electronics, announced at the Innovate Maryland event.

This marks another milestone for Dr. Agonafer, who also received a Presidential Early Career Award and now leads UMD’s efforts in the NSF EARTH Engineering Research Center. Their invention promises major advances in cooling technologies for next-gen electronics.

Electronic Part Obsolescence Forecasting, Mitigation and Management

Counterfeit Parts Detection using SAE AS6171

Use of Component Documentation and Supply Chain Evaluation for Counterfeit Avoidance

Flip chips are widely used in electronic systems for defense, aerospace, and other applications where packaging reliability is critical. However, flip chip defect samples present a variety of defect types and few samples with labels in actual industrial applications. ...

As a key component of rotating machinery, the operation, maintenance, and health management of bearings are of great significance, yet challenges such as the low bearing remaining useful life (RUL) prediction accuracy and the poor generalization persist. To address the above issues, this paper proposes a meta-transfer-driven method for cross-domain RUL prediction of rolling bearings with limited data. ...

This study designs and fabricates a small-scale, counter-flow Multi-Pass Microchannel Heat Exchanger (MPMHX) with a high surface area density of 989 m²/m³ using selective laser melting printing process, achieving a power density of 45.4 MW/m³. The MPMHX features fin and microchannel widths of 0.180 mm and 0.762 mm, respectively, to enhance power densities with sCO₂. ...